Solution Silicon Wafer (Semiconductor Substrate) Inspection Solution
| Target | Inspection of LCD, semiconductor, organic EL, etc. |
|---|---|
| Challenges addresses by this solution |
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Autofocus unit achieves both inspection precision and speed
This solution achieves high-precision, high-speed board inspection by combining a line camera and an autofocus unit.
First, the entire board is photographed with a line camera to roughly detect defects with a resolution of 2μ. Based on these defect coordinates, an autofocus unit performs a detailed inspection with a high accuracy of 0.2μ, thereby improving inspection accuracy and efficiency.
Furthermore, defect information can be classified using Deep Learning, helping to reduce manpower requirements.
First, the entire board is photographed with a line camera to roughly detect defects with a resolution of 2μ. Based on these defect coordinates, an autofocus unit performs a detailed inspection with a high accuracy of 0.2μ, thereby improving inspection accuracy and efficiency.
Furthermore, defect information can be classified using Deep Learning, helping to reduce manpower requirements.
Example of system configuration
Technical Features
Semiconductor wafer inspection solution
- Achieves 0.2μ high-precision defect detection at high speed
- Fully automated process from defect detection to classification using Deep Learning to reduce manpower
- Mechanical design with vibration reduction measures to achieve high-precision detection
A line camera photographs the entire board and roughly detects defects with a resolution of 2μ.
Based on the defect coordinates, the autofocus unit performs detailed inspection with a high accuracy of 0.2μ.
Defect information can be classified using Deep Learning.
On the defect inspection main screen, you can check the size and shape of detected defects by comparing the overall image with the detailed image.